Process of making rail-bonds.



No; 868,664. PATENTED OCT. 22, 1907.

A. B.'HERRIGK.

PROGESS OF MAKING RAIL BONDS.

APPLIOATION FILED MAY 5, 1904.

2 SHEETS-SHEET 1.

PATENTED OCT. 22, 1907.

A.-B. HERRIOK. PROCESS OF MAKING RAIL BONDS.

APPLICATION FILED MAY 5, 1904.

2 SHEETS-SHEET 2 rlvrsscs:

N E -F w ALBERT n. nERnIo o1" innoEnooD, New IJERSEY, Assnz'non To THE ELEICI'IIRIC IRAILWA-IY 1Mrnovsinm'reOMPANY, or CLEVELAND, 0III0,A CORPORATION or OHI To all whom it may concern: a V

-Be it known that I, ALIBIERT B. Hit-BRICK, a citizen of the United States, and aresident of Ridgewood,- county oi Bergen; and State of New Jersey, have invented a new and useful Improvement in Processes of Manufacturing Rail-Bonds, of which the following is a specification, the principle of the invention being herein explained, and the best mi'ldcin which I have contemplated applying that principle, so as to distinguish it from other inventions. I

My invention relates to a process' of manufacturing rail-bonds, and has especial reference to bonds which are adapted tobe used in electrical bonding. Said in vention 'consists of steps hereinafterfullydescribcd and specifically set forth in the claims.

I 1 Specification of Letters Patent. Applicntidniilsd May 5,19 4; Serial No. 206.497.

-The annexed drawings and the following description set forth in detail one mode of carryhig out theinve tron, such disclosed mode constituting but one of various ways in which the principle of the invention may he used.

'In said annexed -drawings:l igure 1 represents a perspective view of a pattern .or. former used in manufacturing my improved bond. Fig'. 2 represents the same view as Fig. '1 with a structure composed of copper strands wrapped upon the former and diametrically opposite portions of the same covered with a flux.

' Fig. 3 represents the sanic.\\'itl1 the flux covered by a opposite sides asa and having a small notch a.

. surrounding cap of solder.

Fig. 4 is the same with the structure cut asunder into two identical parts through the center of the solder strips. Fig. 5 represents an end elevation oi one of the terminals of a completed bond. I

In the manufacture of my improved bondI utilize a pattemor former A; Fig. 1. provided with 5 central raised portion or boss a cut away at two diametrically cut-away portions (1 are designed to. recei ve the ends of solder strips, hereinafter more fully described, and enable same to bind closely upon the copper strands of the bonds. The former i -hash; central transverse slot or fissure a, penetrating it to a depth somewhat helowthe lower'surface oi the boss (2. Que end b of the bonding strand B is fastened in the notch a and by suitable apparatus the honding wire ii is wound spirally around the central boss a until the desired quantity has been wound into an ellipiically shaped structure 0, as

- shown in Fig. 2 each successive convolution oi strand B being.wouud upon the previous com lution. A

flux that is non-corrosive to metals, such as u resinous paste containing an alkali salt, is then spread over the structure, over and for some distance on eiiln-r side of the fissure a, as shown in Fig. 2 at a. This llux is adapted, whon a currentoiyloctricity is passed through the bond, to integrally bind together thrcopper conducting strands and the solder strips, hereinafter dc- The PRocEssoF MAKING Ran-Bonus.

' scribed. Especially prepared sold rls'trips a are then titted over the structure, upon and oyer thefiux a, er ctended into the cut-away portions a otthe boss a, andv fastened to the sain'e by pressure, all as can he seeninFig.

,3. These solder strips are thus fastened bypi'essiire while cold, inasmuch as eachreheating of solder-lessens; I

its electrical conductivity, and, in the use to which it is applied in my invention, this would materially reducethe eiiiciency of the finished bond. A5 can be seen from the drawings, thelhui portinnsnnd the solderstrips iietrans'verseiy'and centrally over the fissure 11". The structure 0 is then sawed into two horse-shoe shaped bonds 0 and 0' through such central transverse plane of he solder strips, the depth of the fissure a enabling this to be easilyaccornplished. The end bof thehonding I strand ii that is fastened in the notch a is then released I forth, as any desired shape may he used. Neith'er would it be always necessary to make only two bonds on one pattern at one time, nor to malie themidentical, as more than two might be manufactured'from one series of strands, and thcy'might, for especial purposes,

claim as my in vention 1. In a process of maniitacturing raii -bonds, the steps which consist, in forming the bond-strands into tlIG'dQ- sired 'shape'upon i suitable pattern, and then fitting solder 2. in a process of nmnuiucturing ruilbonds, the steps which consist, in forming the bond struniis into the desired shape upon a suitable pattern, and then lilting cold solder strips by pressure to said structure over the pur- .tlons ot the some that are to be utilized for the terminals of the bond. I e .-3. In a process of mni'ulfaciuring rull-honds, the steps which consist, in for ring; the bond slrnnds into the destrlps over such flux. 4. in a pr cess oi nmnufuclurim. rnli-honds, the steps which consist. in forming the bond strands into the dehonris with n nun-corrosive ilux, :imi 'iln-u lilting cold solder .\lll|l.\' by pressure over such llux. v

o. In a process of manufacturin raiLbondm the steps I therefore particularly point out and distinctly I 90 are to be utilized for the terminals of the bond. 5 II sired shnpe upon .1 suitable pnliern. covering the portions oi said structure to Inuiilizcd for the terminals of the awhich'consist, in winding upon 5 suitablepattern a strand of n ducting" materiel, each, successive convolution of such strung} around such nuttern *beihg wound upon the 'previpus"convoiution,'coveringportions of the structure hus"t orme d 'with a non'cori'osije fluxj fitting solder strips ,ouer such flux, and then cutting through such strips and ,fluxdmd 'adjuceut portions otthe strands to form a plu- J ailt of bonds. 4 l;

he process of manufacturing rail-bonds, which so .l'o :sists. in 'wincling upon a suitable pattern a strand 0; con-- ducting material -to form a spiral structure, bollgtji 'g'two iametriculiy opposite portions at said structure "with a (in-corrosive flux fittihg'col d 'soider strips b'y' pressure' "ground suchportions andover'such flux, and than cutting denticai bonds.

for nmnu tnctu rin g raii bonds, whiohcbnflrii: tyinding bond strandsabout suitnbie p'uttern" to torm'a co'n nuous nd structure or loop, applying and securing soide ng riak to said structure at diametricaiiy opposite poin thereon, and than cutting through said solderingmateriai and structure at both said points.

8. The process of manufacturing rail-bonds, which consists in winding upon a pattern of substantialiy elliptical outline a strand ot. conducting material, each successive 'onvolutibn at such strand being wound upon the previous convolution, covering dian'ietricaliy opposite portions of the structure thus formed with u non-corrosive flux, fitting solder strips: pv'er such flux, and then cutting through such strips and flux and adjacent portions of the strands to form two similar bonds. t

Signed hy"me,tl 1is 2 day of May 1904.

A ALBERT B HERRICK. tteste'd 'hy- G. W. SAywn'Ln, A. E. Mlcnxnn} 

